公司概况
台湾积体电路制造股份有限公司（台湾证券交易所代码：2330，美国NYSE代码：TSM）成立于西元1987年，在半导体产业中首创专业积体电路制造服务模式。西元2024年，台积公司为522 个客户提供服务，生产11,878 种不同产品，被广泛地运用在各种终端市场，例如高效能运算、智能型手机、物联网、车用电子与消费性电子产品等；同时，台积公司及其子公司所拥有及管理的年产能超过一千六百万片十二吋晶圆约当量。台积公司在台湾设有四座十二吋超大晶圆厂（GIGAFAB® Facilities）、四座八吋晶圆厂和一座六吋晶圆厂，并拥有二家百分之百持有之海外子公司 – 台积电（南京）有限公司之十二吋晶圆厂及TSMC Arizona Corporation之二座十二吋晶圆厂、一家持有多数股权之海外子公司 – JASM（Japan Advanced Semiconductor Manufacturing, Inc.）之十二吋晶圆厂、及二家百分之百持有之海外子公司 – TSMC Washington、台积电（中国）有限公司之八吋晶圆厂的产能支援。
在西元2024年，台积公司开始其于德国德勒斯登兴建特殊制程晶圆厂的工程，并预计于西元2027年底开始生产台积公司28/22奈米平面互补金属氧化物半导体（CMOS）及16/12奈米FinFET晶体管技术。
在台湾以外，台积公司在北美、欧洲、日本、中国大陆，以及南韩等地均设有子公司或办事处，提供全球客户实时的业务与技术服务。
台积公司股票在台湾证券交易所上市，股票代码为2330，另有美国存托凭证在美国纽约证券交易所挂牌交易，股票代号为TSM。
Company Profile
TSMC (TWSE: 2330, NYSE: TSM) created the semiconductor Dedicated IC Foundry business model when it was founded in 1987. In 2024, TSMC served 522 customers and manufactured 11,878 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. Annual capacity of the manufacturing facilities managed by TSMC and its subsidiaries exceeded 16 million 12-inch equivalent wafers in 2024. These facilities include four 12-inch wafer GIGAFAB® fabs, four 8-inch wafer fabs, and one 6-inch wafer fab – all in Taiwan – as well as two 12-inch wafer fab at two wholly owned subsidiaries – TSMC Nanjing Company Limited and TSMC Arizona Corporation, one 12-inch wafer fab at a TSMC's majority-owned manufacturing subsidiary – Japan Advanced Semiconductor Manufacturing, Inc. (JASM), and two 8-inch wafer fabs at two wholly owned subsidiaries – TSMC Washington and TSMC China Company Limited.
The Company began construction on a specialty technology fab in Dresden, Germany, in 2024. This facility will manufacture TSMC's 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technologies, with production targeted to start in 2027.
Outside of Taiwan, TSMC provides customer support, account management and engineering services through its offices in North America, Europe, Japan, China, and South Korea.
The Company is listed on the Taiwan Stock Exchange (TWSE) under ticker number 2330, and its American Depositary Shares (ADSs) are traded on the New York Stock Exchange (NYSE) under the symbol TSM.
Financials
Market Capitalization as of 1/31/2025
NT￥30.67 Trillion, or US￥938.5 Billion
MarketCap
Shares Outstanding as of 1/31/2025
Common Shares: 25,933 million shares
Revenue & Net Income
Revenue
Net Income
*Starting in 2015, TSMC prepares financial statements in accordance with 2013 IFRSs version endorsed by Taiwan. Under IFRS, the impact of newly effected GAAP shall be retroactively applied. Net Income for 2014 were adjusted accordingly.
公司治理
TSMC advocates and acts upon the principles of operational transparency and respect for shareholder rights. We believe that the basis for successful corporate governance is a sound and effective Board of Directors. In line with this principle, TSMC Board of Directors delegates various responsibilities and authority to three Board Committees, Audit and Risk Committee, Compensation and People Development Committee, and Nominating, Corporate Governance and Sustainability Committee. Each Committee’s chairperson regularly reports to the Board on its activities and recommendations.
公司组织
董事会
Board Structure
TSMC’s Chairman, Dr. Mark Liu, retired from the Company after the Annual Shareholders’ Meeting on June 4, 2024. At the meeting, TSMC shareholders elected a new Board of Directors, which then convened to elect Dr. C.C. Wei as Chairman and Chief Executive Officer (CEO).
TSMC’s Board of Directors consists of ten distinguished members with a great breadth of experience as world-class business leaders or professionals. We deeply rely on them for their diverse knowledge, personal perspectives, and solid business judgment. These professionals include citizens from Taiwan, Europe and the U.S. with world-class business operating experience. The current board members are: Chairman Dr. C.C. Wei, Dr. F.C. Tseng, Mr. Chin-Ching Liu (Representative of the National Development Fund, Executive Yuan), Sir Peter L. Bonfield (Independent Director), Mr. Michael R. Splinter (Independent Director), Mr. Moshe N. Gavrielov (Independent Director), Dr. L. Rafael Reif (Independent Director), Ms. Ursula M. Burns (Independent Director), Ms. Lynn L Elsenhans (Independent Director), and Dr. Chuan Lin (Independent Director). TSMC’s Board consists of a diverse group of professionals from different industries, academic and other backgrounds. The Board includes two female directors, and 70% of its members are Independent Directors.
Board Responsibilities
Inheriting the spirit of TSMC’s Founder, Dr. Morris Chang’s philosophy on corporate governance, under the leadership of Chairman Dr. C.C. Wei, TSMC’s Board of Directors takes a serious and forthright approach to its duties and is a dedicated, competent and independent Board.
The Board’s primary duty is to supervise the Company’s compliance with relevant laws and regulations, financial transparency, timely disclosure of material information, and maintaining of the highest integrity. TSMC’s Board of Directors strives to perform these responsibilities through its Audit and Risk Committee, Compensation and People Development Committee, Nominating, Corporate Governance and Sustainability Committee, the hiring of a financial expert consultant for the Audit and Risk Committee, and coordination with our Internal Audit department.
The second duty of the Board of Directors is to appoint and dismiss officers of the Company when necessary, to evaluate management performance and to review the succession plan for senior executives. TSMC’s management has maintained a healthy and functional communication with the Board of Directors, has been devoted in executing guidance of the Board, and is dedicated in running the business operations, all to achieve the best interests for TSMC shareholders.
The third duty of the Board of Directors is to resolve critical matters, such as capital appropriations, investment activities, dividends, etc.
The fourth duty of the Board of Directors is to provide guidance to the Company’s management team and risk management. In each quarter, TSMC’s management reports to the Board on various subjects (including ESG programs) and strategies, and spends substantial time and effort to communicate with the Board. The Board would comment on the risk and probabilities for success of the proposed corporate strategies. The Board also periodically oversees those strategies’ implementation and outcomes, and may suggest the management team to make adjustments to the strategic goals and objectives if necessary.
Board Diversity and Independence
TSMC Board of Directors members are nominated via rigorous selection processes. TSMC established both the “Guidelines for Nomination of Directors” that set out the procedures and criteria for the nomination, qualification and evaluation of Director candidates to be nominated by the Board of Directors, and the “Corporate Governance Guidelines” that set out the criteria for evaluating director candidates for election by the shareholders shall be based on, among other considerations, their professional knowledge, experience, business judgment, commitment to uphold the Company’s core values, as well as reputation in both ethical conduct and leadership. Diversity of backgrounds (including gender, age, and culture) of Board members shall also be considered. The goal of the Company is to have a diverse and independent Board. Currently, the Board comprises ten members with diverse perspectives, and a complementary mix of skills, experiences, and from different industry, academia and other backgrounds. These professionals, including who are citizens from Taiwan, Europe and the U.S. have world-class corporate management experiences. Seven Independent Directors make up 70% of the Board, with no marital or within second degree of kinship relationships among them, ensuring the Board’s independence.
委员会
Audit and Risk Committee
The Audit and Risk Committee assists the Board in fulfilling its oversight of the quality and integrity of the accounting, auditing, reporting, and financial control practices, as well as risk management of the Company.
The Audit and Risk Committee is responsible to review the following major matters:
Financial reports;
Auditing and accounting policies and procedures;
Internal control systems and related policies and procedures;
Material asset or derivatives transactions;
Material lending funds, endorsements or guarantees;
Offering or issuance of any equity-type securities;
Derivatives and cash investments;
Legal compliance;
Related-party transactions and potential conflicts of interests involving executive officers and directors;
Ombudsman reports;
Fraud prevention and investigation reports;
Corporate information security;
Corporate risk management;
Performance, independence, qualification of independent auditor;
Hiring or dismissal of an attesting CPA, or the compensation given thereto;
Appointment or discharge of financial, accounting, or internal auditing officers;
Assessment of Committee Charter and fulfillment of Committee duties;
Self-assessment of the Committee’s performance; and
Any other matters that shall be reviewed by the Audit and Risk Committee Meeting as required by relevant laws and regulations or its Committee Charter, or that are deemed to be material by the regulatory authorities.
Under R.O.C. law, the membership of audit committee shall consist of all independent directors. TSMC’s Audit and Risk Committee satisfies this statutory requirement. The Committee also engaged a financial expert consultant in accordance with the rules of the U.S. Securities and Exchange Commission. The Audit and Risk Committee annually conducts self-evaluation to assess the Committee’s performance and identify areas for further attention.
TSMC’s Audit and Risk Committee is empowered by its Charter to conduct any study or investigation it deems appropriate to fulfill its responsibilities. It has direct access to TSMC’s internal auditors, the Company’s independent auditors, and all employees of the Company. The Committee is authorized to retain and oversee special legal, accounting, or other consultants as it deems appropriate to fulfill its mandate.
Compensation and People Development Committee
The Compensation and People Development Committee assists the Board in discharging its responsibilities related to TSMC’s compensation and benefits policies, plans and programs, in evaluation of compensation of TSMC’s directors of the Board and executives, and the review of the pipeline planning of the Company’s senior executives to ensure the long-term sustainability of the Company.
The members of the Compensation and People Development Committee are appointed by the Board as required by R.O.C. law. According to its charter, the Committee shall consist of no fewer than three independent directors of the Board, whereas the actual Committee is comprised of four Independent Directors. The Chairman of the Board and the Chief Executive Officer are invited by the Committee to attend all meetings and are excused from the Committee’s discussion of their own compensation.
TSMC’s Compensation and People Development Committee is authorized by its charter to retain an independent consultant to assist in the evaluation of CEO’s or executive officer’s compensation.
Nominating, Corporate Governance and Sustainability Committee
The Nominating, Corporate Governance and Sustainability Committee assists the Board in strengthening the selection mechanism for directors, building diversified and professional board, selecting candidates for nomination to be elected as independent directors to the Board, and advising on corporate governance and sustainability matters.
According to its Charter, the Committee shall be composed of the Chairman of the Board and three to six independent directors. Currently, the Committee consists of the Chairman of the Board and three Independent Directors.
The Nominating, Corporate Governance and Sustainability Committee is authorized by its Charter to hire independent legal, financial and other advisors as it may deem necessary to fulfill its responsibilities.
专业集成电路
制造服务
领先技术
概述
逻辑制程
Logic Technology Timeline
A16制程
台积公司A16™是我们下一代的奈米片（Nanosheet）晶体管技术，并采用超级电轨技术（Super Power Rail，SPR）。台积公司的SPR是具有独创性、领先业界的背面供电解决方案。SPR将供电线路移到晶圆背面，以在晶圆正面释放出更多讯号线路布局空间，来提升逻辑密度和效能。SPR也能大幅度降低IR drop，进而提升供电效率。更重要的是，我们独特的backside contact技术能够维持与传统正面供电下相同的 闸极密度（Gate Density） 、布局版框尺寸（Layout Footprint）和组件宽度调节的弹性，因此可以提供最佳的密度和速度上的优势，这也是业界首创的技术。
2奈米制程
台积公司2奈米（N2）技术开发依照计划进行并且有良好的进展。N2技术采用第一代奈米片（Nanosheet）晶体管技术，提供全制程节点的效能及功耗进步，预计于民国一百一十四年开始量产。
主要客户已完成2奈米硅智财设计，并开始进行验证。台积公司并发展低阻值重置导线层、超高效能金属层间电容以持续进行2奈米制程技术效能提升。
台积公司N2技术于民国一百一十四年开始量产时，将成为业界在密度和能源效率上最为先进的半导体技术。台积公司N2技术采用领先的奈米片晶体管结构，其效能及功耗效率皆提升一个世代，以满足节能运算日益增加的需求。N2及其衍生技术将因我们持续强化的策略，进一步扩大台积公司的技术领先优势。
3奈米制程
台积公司于2022年领先业界成功大量量产3奈米鳍式场效电晶体（3nm FinFET，N3）制程技术。N3为业界最先进的半导体逻辑制程技术，具备最佳的效能、功耗及面积（PPA），是继5奈米（N5）制程技术之后的另一个全世代制程。而在N3制程技术之后，台积公司推出支援更佳功耗、效能与密度的强化版N3E及N3P制程。此外，台积公司进一步提供广泛的技术组合满足客户多样化的需求，其中包括为高效能运算应用量身打造的N3X制程、以及支援车用客户及早采用业界最先进制程技术的N3AE解决方案。
5奈米制程
台积公司于2020年领先业界量产 5奈米鳍式场效晶体管（5nm FinFET, N5）技术，协助客户实现智能型手机及高效能运算等产品的创新。此一技术是台积公司继7奈米FinFET强效版（N7+）之后第二代使用极紫外光（EUV）技术的制程。
台积公司持续推出广泛的5奈米系列制程，以满足客户多样化的需求，其中包括支持更佳功耗、效能与密度的N5P、N4及N4P制程、为高效能运算应用量身打造的N4X制程、以及支持车用电子应用的N5A制程。
N5、N5P、N4以及N4P制程已进入量产并具备优异的良率。
7奈米制程
台积公司于2018年领先全球专业积体电路制造服务领域量产7奈米鳍式场效电晶体（7nm FinFET，N7）技术，此一技术是台积公司量产速度最快的技术之一，并同时针对行动运算应用及高效能运算元件提供优化的制程。此外，7奈米FinFET强效版（N7+）技术于2019年开始量产，是全球积体电路制造服务领域首个应用极紫外光（EUV）于商业运转的技术。 N7及N7+技术已为客户量产5G及高效能运算产品多年，并于2021年开始为客户量产消费性电子与车用电子产品。
2019年，台积公司更进一步强化领先业界的7奈米技术，推出6奈米技术（N6）。N6技术自2020年进入量产以来，广泛应用于手机、高效能运算，以及消费性电子产品。N6超低功耗（Ultra-low Power，ULP）技术－N6e™正在顺利开发中，其制程设计套件（Process Design Kit，PDK）已于2023年完成。
16/12奈米制程
台积公司于2013年11月领先全球专业积体电路制造服务领域，成功试产16奈米FinFET（Fin Field Effect Transistor，鳍式场效电晶体）制程技术。2014年，台积公司领先全球专业积体电路制造服务领域，为客户产出业界首颗功能完备的16奈米鳍式场效电晶体制程技术（Fin Field-Effect Transistor，FinFET）网通处理器。
而继16奈米FinFET制程技术之后，台积公司进一步推出16奈米FinFET强效版制程（16FF+），由于良率与效能的快速攀升，16FF+制程已于2015年7月领先业界进入量产，并自2017年起为客户开始生产汽车产业应用产品,同时在晶片交期与产能提升上创下许多纪录。
此外，更具成本效益的16奈米精简型制程技术（16nm FinFET Compact Technology，16FFC） 已于2016年第一季进入量产且出货量快速提升，该制程同时进行晶片线宽微缩及制程简化，因此能够在降低晶片成本方面发挥最大效益。而12奈米精简型制程技术（12nm FinFET Compact Technology，12FFC） 更进一步将晶体密度提升至该16奈米世代的极致, 已于2017年第二季进入生产。
台积公司的16/12奈米制程拥有当今业界16/14奈米技术的最高效能，与台积公司20奈米系统单晶片制程相较， 16/12奈米速度增快 50% ，在相同速度下功耗降低60%，能够协助客户达到最佳效能与功耗，成功支援下一世代高阶行动运算、网路通讯、消费性产品以及车用电子产品的应用。
20奈米制程
台积公司于2014年领先全球专业积体电路制造服务领域，成功以双重曝刻（Double Patterning）量产客户20奈米产品，并于该年度缔造最快速产能提升（fastest ramping）纪录。
由于具备能源效率更佳的电晶体及导线，并藉由导入领先全球的双重曝刻（Double Patterning）技术，20奈米技术在效能及功耗方面皆较前几代制程技术更具竞争优势。
22奈米制程
22奈米超低功耗制程技术（22nm Ultra-Low Power, 22ULP）发展系根基于台积公司领先业界的28奈米制程，并于2018年第四季完成所有制程验证。与28奈米高效能精简型制程技术（28nm High Performance Compact，28HPC）相较，22ULP技术拥有晶片面积缩小10%，及效能提升超过30%或功耗降低超过30%的优势，以满足影像处理器、数位电视、机上盒、智慧型手机及消费性产品等应用。
22奈米超低漏电制程技术（22nm Ultra-Low Leakage, 22ULL）已顺利完成开发并于2018年第四季按计划开始试产，能够支援物联网及穿戴式装置相关产品应用。与40奈米ULP及55奈米ULP制程相较，新的ULL元件和ULL静态随机存取记忆体（Static Random Access Memory, SRAM）可以大幅降低功耗。
28奈米制程
台积公司于2011年领先专业积体电路制造服务领域推出28奈米泛用型（General Purpose）制程技术，之后，台积公司持续扩展其28奈米系列技术，为客户需求提供业界最完备多样的28奈米制程选项，为客户生产更高效能、更节能及更环保的晶片产品。
台积公司28奈米制程技术具备高效能、低功耗等优势，能够支援客户的各式产品应用，包括智慧型手机5G行动晶片、自动高频率雷达感测器、消费性电子、物联网装置等。针对智慧型手机之主流产品及消费性电子应用，台积公司提供了广泛多样的28奈米逻辑制程技术，如28奈米高效能精简型制程技术（28nm High Performance Compact，28HPC）及28奈米高效能精简型强效版制程技术（28nm High Performance Compact Plus，28HPC+）等，以及完备的硅智财，满足客户对高效能、低功耗晶片产品的需求。
针对客户物联网的产品创新，台积公司除了提供28奈米逻辑技术，亦以其逻辑技术为基础，建构了领先、完备，且高整合度的超低功耗技术（Ultra-low Power，ULP）平台，包括28奈米ULP等技术已被各种物联网系统单晶片（IoT system-on-a-chip，IoT SoC）和电池供电的产品所广泛采用以延长电池寿命。
此外，台积公司提供广泛而且具竞争力的车用规格特殊制程技术，包括28奈米嵌入式快闪记忆体（Embedded Flash），28奈米电阻式随机存取记忆体（RRAM），28奈米毫米波射频（millimeter wave，mmWave）和极低漏电（Ultra-low Leakage）元件技术等。
40奈米制程
台积公司于2008年领先专业积体电路制造服务领域，采用40奈米制程技术为多家客户量产晶片。此一技术结合了193奈米浸润式曝光显影制程以及超低介电系数元件连接材料，除了更佳的晶片效能及耗电量优势之外，更创下业界静态随机存取记忆体单位元面积仅有0.242平方微米以及巨集尺寸最小的纪录。
除了台积公司40奈米泛用型及40奈米低耗电制程之外，台积公司陆续推出更多样的40奈米逻辑制程技术以满足客户不同的产品需求，包括40奈米低耗电强效版以及40奈米超低耗电等制程。
在产品应用方面，40奈米泛用型制程技术适用于高效能的产品应用，例如中央处理器、绘图处理器、游戏机、网路、场域可程式化逻辑闸阵列（FPGA）以及硬碟驱动晶片等产品应用；40奈米低耗电量及40奈米低耗电强效版制程则适用于智慧型手机、数位电视（DTV）、机上盒（STB）、游戏晶片及无线网路连接产品等应用；40奈米超低耗电制程适用于物联网及穿戴式装置相关产品应用。
时至今日，40奈米技术平台延伸到特殊制程技术，包含混合讯号／射频（MS/RF）、嵌入式快闪记忆体 （embedded flash）、双极-互补金氧半导体-双重扩散金氧半导体（BCD）、绝缘层上覆硅（Silicon On Insulator, SOI）来延伸产品应用，例如5G毫米波前端模组设计使用射频技术，电源开关应用使用BCD技术，微电脑控制器使用嵌入式快闪记忆体技术等。
65奈米制程
台积公司于2005年领先专业积体电路制造服务领域成功试产65奈米晶片，并于2006年成功通过65奈米制程技术的产品验证，并针对客户需求率先推出低耗电量（Low Power）制程技术。
之后，更迅速推出不同产品应用的65／55奈米制程，包括泛用型（General Purpose）、混合讯号／射频低耗电技术等制程、多次可程式非挥发性记忆体制程、嵌入式快闪记忆体、高压制程、BCD电源管理以及微机电制程等。其产品应用相当广泛，包括行动装置、电脑、车用电子、物联网以及穿戴式装置等。
台积公司65／55奈米制程技术是第三代同时采用铜制程及低介电质技术。与前一世代的90奈米制程技术相较，65／55奈米制程技术的标准元件密度增为两倍。此一制程具备更高的整合性、更好的晶片效能，并拥有创新电源管理技术，能大幅降低耗电量。
90奈米制程
台积公司领先全球于2004年12月日本半导体展（SEMICON Japan）中，发表已顺利使用浸润式曝光（Immersion Lithography）机台产出90奈米晶片、并通过功能验证的研究成果。
台积公司创新的浸润式曝光技术，采用以水为介质的一九三奈米浸润式曝光机，取代传统的一五七奈米干式曝光机，改写了全球半导体产业的曝光机规格。此项创新不仅进一步强化台积公司的技术领导地位，更协助全球半导体业突破摩尔定律（Moore’s Law）的挑战，得以继续推进更先进的制程技术。
0.13微米制程
台积公司领先全球半导体业界，成功开发0.13微米系统单晶片（System-on-a-Chip，SoC）铜／低介电系数（Cu/Low-K）制程技术，其中重要的关键在于台积公司坚持技术自主开发。在技术开发初期，台积公司婉拒与国际知名半导体整合元件制造商的合作方式，选择在建立自己的研发团队，最后不仅领先自行开发完成，并将先进技术在国内生根，成为台湾半导体产业成长的重要契机。
台积公司此项技术涵盖多种世界级 SoC 互补式金属氧化物（CMOS）电晶体制程平台、超小尺寸的静态随机存取记忆体（SRAM，2.43-1.87 平方微米）、世界最新的 193 奈米微影技术，和世界第一的八层低介电质（K<＝2.9）铜导线。其应用相当广泛，包括各式各样的消费性电子、电脑、行动运算、车用电子、物联网及穿戴式装置等。
0.18微米制程
台积公司领先全球在1998年就推出了世界第一个0.18微米低耗电制程技术。之后，更每隔两年就领先竞争对手推出下一代新的低耗电制程技术，从0.13微米、90奈米，一直到今日最先进的20及16奈米技术。
低秏电制程是一个非常重要的制程技术，这些低耗电制程技术，造就了过去十多年来突飞猛进的行动智慧电子技术的发展，对今日的世界及每个人的生活都有着非常大的影响。它的应用范围非常的广泛，包括行动电话、无线通讯、平板电脑、蓝芽装置、各式可携式的消费电子产品，以及游戏机产品等。
此外，台积公司拥有业界最完备的超低耗电技术平台，涵盖0.18微米到16奈米FinFET的超低耗电制程，以满足物联网及穿戴式装置市场多样化的需求与创新。相较于前一代的低耗电制程，台积公司的16奈米超低耗电制程能够进一步降低操作电压达20~30%，以减少动态与静态功耗，同时大幅延长物联网及穿戴式产品电池的使用寿命达2~10倍。
3微米制程
台积公司于1987年创立，即秉持｢自主技术｣的策略，并积极进行制程技术开发，以奠定竞争优势。
台积公司成立之初，自台湾工研院移转3.5微米及2.0微米制程技术，并为荷兰飞利浦公司客制3.0微米制程技术。1988年，台积公司在成立短短一年后，成功开发1.5微米制程技术，并陆续成功开发1.2微米、1.0微米、0.8微米、0.6微米、0.5微米、0.3微米及0.25微米制程技术。
1999年台积公司领先全球，推出第一个0.18微米低耗电制程技术。之后，从0.13微米、90奈米、65奈米、40奈米、28奈米、20奈米、16/12奈米，一直到今日最先进的10奈米及7奈米制程技术，台积公司都持续领先，并创下许多傲人的纪录。
台积公司坚持｢自主技术｣策略及不断持续研发投资，使得台积公司成为世界半导体技术的领导厂商，并成为释放全球半导体创新的重要后盾。
特殊制程
特殊制程
Integrated specialty technology platform provides optimal system-level solutions
TSMC provides an industry-leading specialty technologies portfolio that complements its advanced technology leadership. The Company's comprehensive specialty technologies meet specific customer needs and include MEMS, CMOS Image Sensor, Embedded NVM, RF, Analog, High Voltage, and BCD-Power processes, and so on. TSMC's specialty technologies cover a broad range of applications, including mobile devices, automobile electronic systems, medical systems, wearables, and the Internet of Things, that enrich our lives.
MEMS Technology
TSMC introduced the world's first Sensor SoC process technology in 2011. This technology manufactures monolithic Micro Electro Mechanical Systems (MEMS) by integrating TSMC's industry-leading Complementary Metal-Oxide-Semiconductor (CMOS) and wafer stacking technologies.
TSMC Sensor SoC technology ranges from 0.5-micron (µm) to 0.11µm and supports applications including G-Sensors, gyroscopes, pressure gauges, microfluidic, and biological gene chips.
In 2018, TSMC successfully delivered the world's first CMOS-MEMS (Micro-electromechanical Systems) monolithic capacitive barometer, which features sensitivity to altitude changes as small as 5 cm and fits in a package of slightly less than 1 mm2, for various system applications, including personal activity tracking and indoor navigation.
Future plans include the development of next-generation high-sensitivity thin microphone, MEMS Si-pillar TSV (through silicon via) technology.
CMOS Image Sensor
TSMC provides foundry’s most comprehensive CMOS image sensor (CIS) process technology portfolio, featuring more applications, superior resolution, faster speed, and lower power consumption. The technology ranges from 0.5-micron (µm) to 12nm nodes and supports a variety of applications, including smartphone cameras, automotive, machine vision, cloud surveillance, medical care, PC cameras, toys, and more.
As machine vision is quickly deployed in many security, automotive, home, and mobile communication applications, TSMC offers the next-generation global shutter CIS and enhanced near-infrared (NIR) CIS technologies, making machine vision systems safer, smaller, and less power consuming.
TSMC continues to enhance CIS technology and move to the next generation to further strengthen the capabilities of advanced smartphone cameras and automotive imaging applications. In 2023, TSMC helped customers roll out products with the world’s highest dynamic range in performance. The latest automotive CIS products for car safety systems can make the advanced driver-assistance systems (ADAS) and autonomous driving systems smarter and safer.
eFlash
Non-Volatile Memory (NVM) includes the industry common One-Time-Programmable memory (OTP), Multiple-Time-Programmable memory (MTP), Flash memory (Flash), and next generation NVM of Magnetic RAM (MRAM) and Resistive RAM (RRAM).
MS/RF
TSMC provides foundry's most advanced and comprehensive portfolio of Embedded NVM technologies, featuring fastest computing capacity, smallest flash dimensions, and lowest power consumption.
TSMC's Embedded Flash technology ranges from 0.5-micron (µm) to 40nm and provides a number of flash IP options to meet a variety of product design requirements. TSMC's 2018 total shipment of Embedded Flash wafers to customers ranked No.1 in the global semiconductor industry, supporting a wide range of applications including consumer electronics, portable electronics, home appliances, smartcards, computers, wired and wireless communications, automotive electronics, medical equipment, industrial automation, the Internet of Things, and wearables.
Meanwhile, TSMC started volume production of 40nm Embedded Flash technology for automotive in 2018, and is now developing the 28nm Embedded Flash. This technical qualification is expected in 2019 for automobile electronics and micro controller units (MCU). At the mean time, TSMC is also developing Embedded MRAM, and Embedded RRAM in parallel to fulfill customers' need of continuous performance improvement and power-consumption reduction. 40nm ULP embedded resistive random access memory (RRAM) technology, which began risk production at the end of 2017, completed consumer grade qualification test for 10,000 cycles of endurance in 2018. This technology is fully CMOS (Complementary Metal Oxide Semiconductor) logic compatible for PDK and IP re-use for applications including wireless MCU, IoT and wearable devices. 22nm ULL magnetic random access memory (MRAM) technology progressed well, demonstrated reflow capability and passed JEDEC 168 hours high-temperature operating life (HTOL) reliability validation at the end of 2018. Through IP customization, MRAMs can serve various applications, such as artificial intelligence and eFlash replacement for MCU.
Analog
TSMC provides foundry’s most advanced and comprehensive portfolio of Mixed Signal/Radio Frequency (MS/RF) technology. TSMC and its customers continue to unleash innovations in the MS/RF segment to meet the growing demand, triggered by the COVID-19 pandemic, for MS/RF chips in wireless connectivity, such as applications in 5G communications, Wi-Fi 7, IoT, and so on. TSMC helps spread the growth of more convenient wireless connectivity, meaning people can communicate more efficiently and “work anytime and anywhere,” significantly increasing the productivity and mobility of modern society.
In 2023, TSMC continued to enhance its RF technology development to provide the best performance/power/cost-tradeoffs solutions. 12FFC+ RF technology, developed on the same logic process platform as N12e™ technology, started volume production for cellular RF and IoT wireless connectivity products.
N6RF technology received multiple customer product tape-outs in 2022, while the second generation of N6RF technology, N6RF+, was in development. This technology is built upon the N6 logic technology platform and will enable future generations of WLAN and 5G RF transceiver integrated circuits.
16FFC FinFET compact (16FFC) RF technology received multiple customer tape-outs in 2021. The development of its enhanced version (Enhancement I/II) was completed in 2022 to support applications such as 28/39/47GHz millimeter wave (mmWave) RF front-end module (FEM) and 77GHz/79GHz automotive radar. In addition, non-conductive stress (NCS) calculator and aging model were introduced in 2023 to support automotive radar power amplifier designs.
TSMC provides foundry’s most competitive and cost-effective analog process technology portfolio. The Company’s comprehensive analog process portfolio offers options from >0.5µm to 16nm, featuring many competitive advantages including high accuracy, low noise, low power consumption, and superior cost effectiveness.
TSMC’s industry-leading analog process technology help customers deliver more competitive analog chips that, as the communication interface between the real world and digital systems, convert natural analog biometrics, light, heat, speed, pressure, temperature, and sound into digital signals accurately. The applications include smartphones, tablets, automotive electronics, computers, audio, electronic medical equipment, and home appliances.
HV
TSMC provides foundry’s most competitive high voltage (HV) technology portfolio. TSMC’s HV processes range from 0.5-micron (µm) to 28nm, featuring higher quality image for panel drivers and lower power consumption for application including TVs, smartphones, tablets, smart watches, and other portable electronic products.
TSMC’s 28nm HV(28HV) technology, built upon the success of TSMC’s leading 28nm High-performance Compact Plus (28HPC+) technology, offers a superior low power advantage based on a low Vdd at 0.9 volt. In addition, it features the world’s first high bandwidth 128Mb static random-access memory (SRAM). TSMC completed 28nm HV (28HV) product IC yield and reliability verification in 2023. 28HV technology is an optimal solution for the next generation of high-end organic light-emitting diode (OLED) display drivers. To bolster the Company’s leading position in the field of high voltage display driver technologies, TSMC is developing 16nm high voltage FinFET with better performance and lower power usage for customers to design more competitive OLED display driver ICs.
Micro organic light-emitting diode on silicon (µOLEDoS) panel technology increases pixel density by five to ten times compared to the traditional OLED on glass technology and can support the growing demand for high-quality augmented reality (AR)/virtual reality (VR) goggles. By working with customers, TSMC successfully demonstrated this technology on both 8-inch and 12-inch HV technologies, which paved the way for AR/VR suppliers to develop next generation goggles for various industrial, medical and consumer electronics applications.
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BCD
TSMC provides foundry’s most comprehensive and competitive bipolar-CMOS-DMOS (BCD) power management process technologies and is the first foundry that brings BCD power management process technologies onto 12-inch wafer for production.
TSMC BCD power management process features higher integration, smaller footprint, and lower power consumption, covering nodes from 0.6µm to 40nm, helping customers deliver better power management ICs with more stable and efficient power supplies that consume less energy, ideal for applications including automotive, consumer electronics, communication devices, and computers.
TSMC continued to increase its 12-inch BCD technology competitiveness in 2023 by expanding its 0.13μm and 90nm BCD technology to meet the demand of the automotive market and server request. The logic baseline of second-generation 40nm BCD is fully compatible to ultra-low power (ULP) process, which also provides 5-28V high-voltage components, thereby enabling more power management chip applications.
In addition, TSMC is developing the world’s most advanced 22nm BCD platform to lower power consumption, more effectively to achieve cost reduction with smaller footprint for customers’ next high-end power management ICs.
ULP
TSMC’s industry-leading ultra-low power (ULP) technologies offer ultra-low leakage (ULL) core devices, ULL SRAM and low operating voltage (low Vdd) solutions. Energy efficiency is essential to digital transformation, also to improve energy consumption, battery life and carbon emissions. Based on TSMC’s best-in-class logic technology, the ULP portfolio includes 40nm (40ULP), 22nm ULL (22ULL) and N12e™ fin field-effect transistor (FinFET) technologies. These technologies support Internet of Things (IoT) applications from wearables, home appliance, to industrial 4.0 and smart cities. The N6e™ process will power the next generation of high performance ultra-efficient edge artificial intelligence (AI) products.
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3DFabric
3DFabric
We are pleased to introduce TSMC 3DFabric®, our comprehensive family of 3D Silicon Stacking and Advanced Packaging Technologies. 3DFabric complements our advanced semiconductor technologies to unleash our customer's innovations.
Packaging technologies were once considered just backend processes, almost an inconvenience. Times have changed. Computing workloads have evolved more over the past decade than perhaps the previous four decades. Cloud computing, big data analytics, artificial intelligence (AI), neural network training, AI inferencing, mobile computing on advanced smartphones and even self-driving cars are all pushing the computing envelope.
Modern workloads have brought packaging technologies to the forefront for innovation and they are critical to a product's performance, function and cost. These modern workloads have pushed the product design to embrace a more holistic approach for optimization at the system level. 3DFabric offers our customers the freedom and advantage to design their products more holistically as a system of mini-chips that offers key advantages versus designing a larger monolithic die.
TSMC's 3DFabric consists of both frontend and backend technologies. Our frontend technologies, or TSMC-SoIC® (System on Integrated Chips), use the precision and methodologies of our leading edge silicon fabs needed for 3D silicon stacking. TSMC also has multiple dedicated backend fabs that assemble and test silicon dies, including 3D stacked dies, and processes them into packaged devices. TSMC 3DFabric's backend technologies include the CoWoS® and InFO family of packaging technologies.
All diagrams, animations and videos are for demonstrative and illustrative purposes only
TSMC's 3DFabric offers our customers the ultimate flexibility in product design, brings packaging technologies to the forefront for innovation, and are critical to a product's performance, function and cost:
Time-to-Market: Customers can reuse technology blocks that do not change frequently or do not scale well to develop chiplets which allow for faster innovation and shorten the time-to-market
Performance and Efficiency: 3DFabric allows the integration of high density interconnected chips into a packaged module delivering improved bandwidth, latency, and power efficiency
Form Factor: Integrate varied logic, memory, or specialty chips with SOCs to deliver smaller form factors for various applications.
Cost: Customers can reuse blocks, such as analog IO, RF, and those that do not change frequently nor scale well, on more mature and lower cost semiconductor technologies. Customers can focus logic designs that scale well on TSMC’s most advanced semiconductor technologies
平台技术
In light of the rapid growth in four major markets, namely smartphone, high performance computing, automotive electronics, and the Internet of Things, and the fact that focus of customer demand is shifting from process-technology-centric to product-application-centric, TSMC has constructed four different technology platforms to provide customers with the most comprehensive and competitive logic process technologies, specialty technologies, IPs, and packaging and testing technologies to shorten customers' time-to-design and time-to-market.
Automotive
未来研发计划
为保持技术领先地位，台积公司计划持续大量投资研发。在台积公司2奈米及14埃米先进CMOS逻辑技术持续进展时，台积公司的前瞻研发工作将聚焦于14埃米以下的技术、三维晶体管、新内存，以及低电阻导线等领域，为未来创新技术平台建立坚实的基础。台积公司的3DFabric®先进封装研发，正在开发子系统整合的创新，以进一步增强先进的CMOS逻辑应用。公司继续聚焦于 新的特殊制程技术，例如用于5G及智能物联网应用的射频及三维智能传感器。台积公司先进研究持续开发可在未来十年及更长时间可能采用的新材料、制程、组件和内存。台积公司也持续与学术界和产业联盟等外部研究机构合作，旨在为客户尽早了解和采用未来具有成本效益的技术和制造解决方案。凭借着高度称职及专注的研发团队及其对创新的坚定承诺，台积公司有信心能够透 过提供客户有竞争力的半导体技术，推动未来业务的成长和获利。
卓越制造
晶圆厂区
产能
超大晶圆厂
工程效能优化
敏捷与智慧生产
开放创新平台
矽智财联盟
电子设计自动化联盟
设计中心联盟
云端联盟
价值链聚合联盟
TSMC 3DFabric™ 联盟
晶圆制造服务
先进封装解决方案
光罩服务
e化晶圆厂
晶圆共乘服务
University FinFET Program
台积大同盟
Innovation Zone
·
人才招募
未来与改变，从这里开始。
借着创新的企图心、跨领域的思考能力，期许全球半导体产业突破性的创新，都有一份我们的努力。
选择台积
最好的工作，是能跟世界一流的人才共事
台积电是世界顶尖的半导体公司，多年来在世界竞争中持续领先，源自于我们有世界上最优秀的伙伴。
好的工作，不只给你好的福利待遇，更让你与最厉害的人成为同事。
选择台积
最好的公司，是做能改变世界的事
你也曾梦想改变世界吗？如今你真的有机会！
台积电是全球半导体的领导者，我们的技术提供各种产品最好的解决方案，每一样颠覆性的产品都需要我们。
选择台积
最好的理念，是愿意承担社会的责任
选择公司，是选择你认同的理念，一间伟大的公司，除了满足客户的利益，还要承担社会发展的责任。
台积电30年来以诚信正直为本，持续以企业公民的角色回馈社会。
应征流程
加入引领世界的台积电，你的每一个成果都将改变世界的脚步。因此理念与价值观是我们最重视的条件，只有志同道合的伙伴，才能承担领导全球的重担。
我们对于选才相当谨慎，透过每一步，让你了解我们是什么样的公司、我们的期待，以及我们一起创造的未来。
填写履历
接受问卷与测验
参加面试
接获录取通知与报到
填写履历
详细学经历、专业技术关键字与自传让您脱颖而出
你的履历将开放给所有台积主管。因此，你可能被邀请参加你应征以外的职位甄选
接受问卷与测验
依职务填写相关应征问卷
英文测验或提供能力证明
参加面试
与一到两位以上主管面谈
会有一至二次面谈
主管会透过email或电话初试确认面试时间
接获录取通知与报到
进行资历查核
依照不同工作与用人单位的状况，甄选时间平均二至四周
通知录取，并寄出聘书
报到需缴交各项文件
报到前认识台积
企业核心价值与经营理念
Values Image
企业核心价值
诚信正直
这是我们最基本也是最重要的理念。我们说真话；我们不夸张、不作秀；对客户我们不轻易承诺，一旦做出承诺，必定不计代价，全力以赴；对同业我们在合法范围内全力竞争，我们也尊重同业的知识产权；对供应商我们以客观、清廉、公正的态度进行挑选及合作。在公司内部，我们绝不容许贪污；不容许有派系；也不容许「公司政治」。我们用人的首要条件是品格与才能，绝不是「关系」。
承诺
台积公司坚守对客户、供应商、员工、股东及社会的承诺。所有这些权益关系人对台积公司的成功都相当重要，台积公司会尽力照顾所有权益关系人的权益。同样地，我们也希望所有权益关系人能对台积公司信守其承诺。
创新
创新是我们的成长的泉源。我们追求的是全面，涵盖策略、营销、管理、技术、制造等各方面的创新。创新不仅仅是有新的想法，还需要执行力，做出改变，否则只是空想，没有益处。
客户信任
客户是我们的伙伴，因此我们优先考虑客户的需求。我们视客户的竞争力为台积公司的竞争力，而客户的成功也是台积公司的成功。我们努力与客户建立深远的伙伴关系，并成为客户信赖且赖以成功的长期重要伙伴。
企业经营理念
坚持诚信正直
这个理念代表公司的品格，是我们最基本也是最重要的理念，也是执行业务时必须遵守的法则。所谓诚信正直（Integrity）是：
我们说真话。
我们不夸张、不作秀。
对客户我们不轻易承诺，一旦做出承诺，必定不计代价，全力以赴。
对同业我们在合法范围内全力竞争，但绝不恶意中伤。同时，我们也尊重同业的知识产权。
对供应商我们以客观、清廉、公正的态度进行挑选及合作。
在公司内部，我们绝不容许贪污；不容许在公司内有派系或小圈圈产生；也不容许「公司政治」(Company Politics)的形成。至于我们用人的首要条件是品格与才能，绝不是「关系」。
专注于「专业集成电路制造服务」本业
我们的本业是「专业集成电路制造服务」，这个领域发展迅速，只要我们能集中力量，积极从事本业的钻研，发展空间必定无可限量。因此，我们要心无旁骛、全力以赴，在「专业集成电路制造服务」本业中谋求最大的成就。
放眼世界市场，国际化经营
我们的目标是全球市场，而不局限于东南亚或任何地区。集成电路是一个跨越国界的产业，全球各主要业者无不将目标延伸到世界各地。而我们最强的竞争者也来自国外，如果我们不能够把眼光放远在世界市场中建立竞争力，我们在国内终究也将无法生存，遑提竞争力。
我们的根在台湾，但要在全世界主要市场建立基地，是国际化经营的意义。而为配合国际多元发展的文化需求，在人才募集方面，我们则不论国籍，惟才适用。
注意长期策略，追求永续经营
我们深知企业永续经营，像是在跑马拉松，需要速度、耐力与策略的配合，而不像是在做五十米、一百米的短程冲刺。
我们确信「人无远虑，必有近忧」的道理，只要我们能做好长期策略规划，并认真的执行，短期较为急就章式的冲刺便会大大减少。
因此，除了每年我们都要为未来五年做一个长期策略规划外，在我们的日常工作中，也应有相当高的程度落实于长期的成效与回收。
客户是我们的伙伴
我们自始就将客户定位为伙伴，绝不和客户竞争。这个定位是我们过去成功的要素，也是未来继续成长的关键。
我们视客户的竞争力为台积公司的竞争力，而客户的成功也是台积公司的成功。
质量是我们工作与服务的原则
包括公司内部或是外部，每个我们所服务的对象，都是我们的「客户」。而「客户满意度」就是「质量」。
在台积公司，质量是每一个员工的责任，我们应坚守岗位，本着追求卓越、精益求精的态度，不但认真的把每一件事、每一件任务做到最好，更要随时检讨，务求改善，追求并维持「客户全面满意」，这就是以「质量是我们工作与服务的原则」的具体实践。
鼓励在各方面的创新，确保高度企业活力
创新是我们的命脉。如果我们一旦停止创新，将很快的面临没落与失败。我们不但要在技术方面追求创新，在企划、营销、管理等各方面更要强调。自然地，积极建立与累积公司的知识产权也不可或缺。
我们更要常保公司充满蓬勃朝气与活力，随时秉持积极进取、高效率的处事态度，来因应瞬息万变的产业特性。
营造具挑战性、有乐趣的工作环境
相信对大多数的同仁而言，一个有挑战性，可以持续学习，而又有乐趣的工作环境，比金钱报偿更为重要。我们要齐力塑造并维持这样一个环境，吸引并留住志同道合而且最优秀的人才。
建立开放型管理模式
我们要营造乐于沟通的环境，以建立开放型管理模式。「开放型」代表同仁间互相以诚信、坦率、合作相待。同仁乐于接受意见，也乐于改进自己。同时，更将透过集思广益的方法接受各方看法，而在做出决定后，就团结一致、不分你我、集中力量朝共同目标戮力以赴。
兼顾员工福利与股东权益，尽力回馈社会
员工与股东同是公司重要的组成份子。我们要提供给员工一个在同业平均水平以上的福利，同时让股东对公司的投资得到平均水平以上的报酬。 同时，公司的成长也得力于社会及产业环境的配合，我们更要不断地尽能力回馈社会，做一个良好的企业公民。
只要全体同仁能够随时信守以上本公司经营理念，并落实于工作中，台积自能不断成长与茁壮，成为国人引以为傲的世界级公司。
台积生活
工作环境
重视人才，重视未来
人才是台积电保持领先的关键，只有幸福的伙伴，才能打造有竞争力的团队，
每一位在台积的伙伴都能享有远超其他企业的薪资与福利。
员工福利
类别 项目 公司作为
假勤 休假日 每年除12天国定假日外，另给予7天纪念日。
特休假 我们重视员工的福祉和工作与生活的平衡故提供年假作为我们整体福利计划的一部分。新进员工在到职的第1年，每服务满2个月即给予1天特别休假。
病假 每月给予10小时全薪的病假，全年在职同仁每年给予120小时全薪、120小时半薪的病假。
健康照护与急难救助 保险 除依法为员工投保劳工保险及全民健康保险，并规划团体综合保险，公费提供包括寿险、意外险、医疗险、癌症险、重大疾病险、生育保险金及因公出差的海外差旅险等保障；此外亦提供多样的自费团体综合保险，让员工以优惠方案为其眷属、子女及父母加保。
医护人员 除符合法定标准，另与医院合作派驻144位医护人员，提供员工紧急救护与健康管理等服务。
健康检查
提供各年龄层每年健检。
针对任职每满5年员工提供5项进阶专案健检（静态心电图、心脏超音波、颈动脉超音波、冠状动脉电脑断层、肺部低剂量电脑断层）。
员工协助方案 提供与身心压力、人际关系、生涯规划、工作问题、情感议题、婚姻家庭、自我探索、情绪困扰、法律问题、财务困扰、身心科医疗等谘商／谘询服务。
员工购股计划 台湾地区所有正职同仁每月可提拨最高上限为月薪的20%做为购股自提金；同仁购买公司股票的总金额中，员工自提金占85%，另外15%由公司提供补助。
生育福利 产假与陪产假
第一胎次产假12周；第二胎次产假16周；第三胎次（含）以上产假20周。
员工配偶有生产事实时，给予陪产检及陪产亲职假共计10个工作天。
生育补助
职工福利委员会每胎生育补助1万元。
公费团保生育保险金，每次最高1万元。
育儿照护与哺育环境
孕妇可持妈妈手册，申请孕妇专用车位。
公司设有哺（集）乳室，方便女性员工集乳需求。
子女未满1岁需亲自哺乳的夜班员工，得视实际需求，申请调至日班工作。
竹中南科厂区设置幼儿园，提供年满2足岁到未满6足岁员工子女教育服务。
台积运动馆设有周末半日／一日的STEAM科普营队。
福委会举办各式活动，让员工与家人、子女共同参加。
友善的工作环境 食衣住行育乐
各厂区提供完善且多元的餐饮选择，另有便利商店、书店、洗衣等便利服务。
提供跨厂区交通接驳与宿舍。
职工福利委员会举办家庭日、运动会、球类竞赛及各类体育活动。
厂区普设健身设施并开设运动相关课程，运动馆提供室内温水游泳池、水疗、烤箱及蒸气室设备。
员工资源团体 公司成立员工资源团体，聚焦性别、种族／国籍、身心障碍面向，以营造多元共融的工作环境。
弹性的上班时间 常日班间接人员可选择（1）7:30-16:30、（2）8:30-17:30、（3）9:30-18:30 三个分流时段到班工作。
志工假 为鼓励参与志工服务，台积同仁每年度可申请1天有薪志工假。
弹性福利计划(tFlex) 为提升员工福利及员工体验，台积电全球推出弹性福利计划(tFlex)，同仁可依个人需求选择最适合自己的福利项目。
退休金制度 台积公司依台湾《劳动基准法》提供确定给付及确定提拨退休金计划，并设立劳工退休准备金监督委员会。每季召开会议、执行劳工退休金相关监督事项，并针对各别退休辧法提存退休准备金，确保足额提拨，保障员工未来请领权益。
包容职场
Diversity, Equity and Inclusion
TSMC is dedicated to creating a diverse, equitable, and inclusive workplace that fosters collaboration among employees from varied cultural backgrounds, professional domains, and life experiences, thus enhancing the Company's innovation and competitiveness. Guided by the principle of meritocracy, TSMC ensures impartial treatment of all employees in recruitment and promotion, prohibiting discrimination based on gender, age, disability, religion, race, ethnicity, nationality, political affiliation, sexual orientation and etc.
Diversity, Equity and Inclusion Statement
关于征贤令--中国首家泛国际人才招聘平台
征贤令由上海韵通信息科技有限公司开发运营，公司主面向国际提供人才求职招聘、高层次人才/科创类人才招聘引进【海外优青、启明计划、线上线下招聘会、校招、社招、网招、猎头等】、学术交流、软件开发等服务，适时我们将上线AI英、韩、日、法、德……等语言平台及APP以满足全球用户需求，截止目前公司已与人社部、科技部等国家部委，部分省市委组织部人才办、人社、工信、科技、工会、商会、学会、协会及全国各大区985211等高校、部分企业HR、国际院士联合体及联合国科技委WDTA、俄罗斯、日本、韩国、新加坡、新西兰、澳大利亚、荷兰、德国、英国、法国、美国、加拿大等国家部分国际机构和QS世界大学百强高校（MIT、牛津、墨尔本大学......）等建立沟通管道
服务项目如下:
A、国际高层次/科创类人才(博士、博士后、院士)招聘引进(线上线下招聘会、校招、社招、网招、猎头等)、境外企业访学、学术交流、软件开发
B、征贤令®运营(平台及公众号人才类型不限)
支持服务地区:
中国、韩国、日本、俄罗斯、新加坡、新西兰、澳大利亚、荷兰、德国、法国、英国、匈牙利、意大利、美国、加拿大等(可辐射100多个)国家和地区
主服务内容:
城市、园区、用人单位线上线下专场高层次人才招聘会、科创类引才活动【项目征集、筛选、路演.....落地等】、招商引资、学术交流会议，网络求职招聘、线下可到上述指定国家。
在过去的2024年我们先后加入了中国湖北省楚商联合会、世界发明家协会联合会【IFIA】并确立了将征贤令打造成中国首家泛国际人才招聘平台（AI英、韩、日、法、德......等语言平台及APP适时将上线。国际HRD(HR)联盟同步发起中）且未来服务于全球200余国家几十亿用户的宏伟目标，截止2024年12月31号我们已得到联合国科技委WDTA理事长回覆2025欢迎韵通科技和征贤令加盟联合国科技委WDTA等合作、2025起将与国际院士联合体开展合作及或将参与FCPAE欧洲论坛等活动合作并助力国际人才交流与合作，进而推动科技创新、带动就业，以服务全球经济建设和促进跨国间友好合作共创美好未来。进而更好地服务于全球各国用户。
IFIA中文全称:世界发明家协会联合会，总部分别位于瑞士日内瓦和美国旧金山，2024年2月经IFIA第47届全球执委会审议通过上海韵通信息科技有限公司【征贤令】加入其组织，详见IFIA官网公示：
https://www.ifia.com/ifia-47th-executive-committee-meeting-held-on-feb-2024/
本公司旗下招聘平台将于2025年2月1日起正式启动收费服务，详情参阅：
https://mp.weixin.qq.com/s/YmOxE1snwAAvskZgwm5RxA
当前我们正面向国际组织高层次人才线上线下专场招聘会，活动详见征贤令®国际高层次人才招聘活动行程计划公众号推文：
https://mp.weixin.qq.com/s/UGfNhxHRoIs1KZF7Thsfxg
征贤令®常年面向全球大量招聘海外高层次人才及创新人才，详见公众号介绍：
https://mp.weixin.qq.com/s/8YaCD8xaXiDeC93a1foUKQ
关于创立发起国际HRD（HR）联盟邀请函，详见公众号介绍：https://mp.weixin.qq.com/s/fdg6QB82KAJCeTi0VZVZKQ
以上欢迎全球各国用人单位HR、高校及科研院所负责人、学术负责人、青年博士/博士后/院士等人才与我们联络或注册加入我们平台，我们所募集的人才将优先推荐至中国国内或全球各大高校科研院所等单位工作。
